Amazon Computing Cloud F1 Example Is Widely Used Xilinx FPGA
When the Amazon cloud network service in the cloud provides a safe and adjustable scale of operation, F1 instance allows users to use FPGA to deploy hardware accelerator more easier.
This entry was posted on 2017年5月9日5 Analysts Rate ABB an Average of Buy
5 Analysts Rate ABB an Average of Buy
This entry was posted on 2016年3月1日
Swissbit signs LOI with Hiddn Solutions for encrypted SSD manufacturing
Both parties intend to collaborate to customise, optimise and test Hiddn’s encryption solution to make it even more suited for volume production at Swissbit’s state-of-the art manufacturing, testing and packaging facility in Berlin.
This entry was posted on 2018年7月27日
New current sense transformers for high-reliability equipment applications now available
Wurth Electronics Midcom has released additional Current Sense transformers to the MID-SNS family.
This entry was posted on 2018年7月20日
TE Connectivity Partners with Annapolis Micro Systems on FPGA Boards with High Density RF Connectors
TE Connectivity (TE), a world leader in connectivity and sensors, is pleased to announce it has partnered with Annapolis Micro Systems, a leading FPGA board and systems supplier, on the release of three of their new high-performance FPGA boards that feature TE’s NanoRF module. The half-size NanoRF is designed to fit into the VITA 67.3 form factor and supports 70 GHz bandwidth, with more than double the RF contact density of existing VITA 67 solutions.
This entry was posted on 2018年7月18日
On Semiconductor opens joint China lab with GoodWe
Chinese power group GoodWe has opened a joint lab with supplier On Semiconductor to develop next generation inverter designs for global markets.
This entry was posted on 2018年7月17日
Advantech to co-create IIoT solutions
Industrial computing solution developer Advantech has announced co-creation of industrial Internet of Things (IIoT) SRPs (solution ready packages) through cooperation with local and international enterprises in various industries.
This entry was posted on 2018年7月12日
Taiyo Yuden will increase its workforce at the Sama Jaya High Tech Park here to over 5,000 by 2021.
During the ground-breaking ceremony for its new factory building project, Deputy Chief Minister Datuk Amar Awang Tengah Ali Hasan said Taiyo Yuden has invested over RM3 billion in its Sarawak operations since its establishment.
This entry was posted on 2018年7月11日
Advantech, partners launch smart medical IoT solutions
Taiwan-based IPC and automation solutions specialist Advantech is taking a big stride forward in promoting the combination of IoT and smart healthcare in the form of SRP (solution-ready package) through cooperating with business partners.
This entry was posted on 2018年7月9日
Advanced biological and chemical sensing interface IC for next generation sensors (ADUCM355)
Analog Devices offers a new sensor interface IC that supports the next generation of intelligent electrochemical sensors. It is claimed to be the only solution available to include potentiostat and EIS functionality on a single chip.
This entry was posted on 2018年7月6日
SunLED Introduces the World’s Smallest RGB SMD LED
By introducing the world's smallest RGB, SunLED has once again revolutionized the optoelectronic industry by designing a full color SMD in an 0202 package size.
This entry was posted on 2018年7月4日
OKI Announces Avery Dennison ICS Performance Guarantee for ColorPainter™ Printer Series
OKI Data Americas, a world-class printing technology leader, announced its ColorPainter™ series of printers has earned an ICS Performance Guarantee from Avery Dennison that guarantees ColorPainter graphic output for up to seven years.
This entry was posted on 2018年6月29日
Trisha Tuntland Joins Littelfuse as Head of Investor Relations
Littelfuse, Inc., (NASDAQ: LFUS) announced the appointment of Trisha Tuntland as Head of Investor Relations, reporting to Meenal Sethna, Littelfuse Executive Vice President and Chief Financial Officer.
This entry was posted on 2018年6月28日
Sensors Expo 2018: Smart Labelling System Eliminates Data Transfer Errors - Fast
TT Electronics’ smart labelling system is groomed for use with its thermocouples. The company’s Roxspur facility is a world class producer of premium thermocouples for the aerospace industry and designed the smart labels to enable users to quickly identify its thermocouples. The smart labels carry a ‘QR code’ that can be scanned by any standard reader or suitably equipped mobile device to quickly and accurately transfer all the encoded data for an individual thermocouple into a customers’ database.
This entry was posted on 2018年6月27日
Vishay Optoelectronics to Exhibit Latest Light to Digital and Analog Output Sensors at Sensors Expo & Conference 2018
The Optoelectronics group of Vishay Intertechnology, Inc. (NYSE:VSH) announced its technology lineup for Sensors Expo & Conference 2018, taking place June 26-28 at the McEnery Convention Center in San Jose, California. In booth 435, Vishay will exhibit its latest light to digital and analog output sensor technologies, including infrared (IR), ambient, proximity, ultraviolet (UV), and RGBW light sensors for consumer, industrial, healthcare, security, and wearable applications.
This entry was posted on 2018年6月26日
Henkel wins CT Building Congress award for renovations to Trumbull facility
Henkel has won the first-place award from the Connecticut Building Congress for major renovations or expansions on its new research and development facility at 4 Trefoil Drive in Trumbull.
This entry was posted on 2018年6月21日
Advantech: new impetus to development thanks to the IoT
After celebrating the 25th anniversary of its presence in Europe, Advantech wants to give a new impetus to development, focusing more on the IoT.
This entry was posted on 2018年6月20日
Vishay Honors Digi-Key with 2017 European Catalog Distributor of the Year Award
Vishay has recognized Digi-Key Electronics Europe with their 2017 European Catalog Distributor of the Year award during a recent visit to the company. The award is based on various KPI including growth, design fulfillment, and inventory management.
This entry was posted on 2018年6月19日
6U VPX FPGA Board Brandishes Two Xilinx Virtex Ultrascale+ FPGAs
Abaco Systems’ VP869 6U OpenVPX FPGA processing board employs two Xilinx UltraScale+ FPGAs and a Zynq 7000 Series multiprocessor system-on-chip (MPSoC).
This entry was posted on 2018年6月15日
ADI claims 200MHz bandwidth RF transceiver
ADI claims to have the industry’s widest bandwidth RF transceiver with a single radio platform IC to deploy 5G, sustain 2G/3G/4G coverage, and simplify phased array radar design.
This entry was posted on 2018年6月14日
NXP Introduces New High Power RF Products for 5G NetworksCompany
Semiconductors N.V. (NASDAQ:NXPI) is driving innovation with its expanded cellular infrastructure portfolio of GaN and silicon laterally diffused metal oxide semiconductor (Si-LDMOS) products that deliver industry leading performance in a compact footprint to enable next-generation 5G cellular networks.
This entry was posted on 2018年6月13日