The Bergquist Company is the world’s leading developer and manufacturer of thermal management materials which include Sil-Pad®, thermally conductive insulators and various specialty materials; Gap Pad®, gap filling materials, Hi-Flow®, phase change materials, Softface® and Bond-Ply®. Bergquist also manufactures one and two layer Thermal Clad®, IMS® (Insulated Metal Substrate) Thermal Clad® HT and Thermal Clad®LTI, thermal management substrates for high power surface mount applications. Bergquist is the global source for the processing of Thermal Clad®, IMS® circuits.
THERMAL PAD TO-3 .009" SP600
THERMAL PAD TO-3 .009" SP600
THERMAL PAD TO-220 .009" SP600
THERMAL PAD TO-220 .009" SP600
THERMAL PAD DO-4 LARGE SP600
THERMAL PAD DO-5 LARGE SP600
THERMAL PAD SIP .009" SP600
THERMAL PAD TO-220 .009" SP600
THERMAL PAD TO-218 .009" SP600
THERMAL PAD TO-220 .009" SP600
THERMAL PAD TO-220 .009" SP600
THERMAL PAD TO-3 .006" K10
THERMAL PAD TO-3 .006" K10
THERMAL PAD TO-220 .006" K10
THERMAL PAD TO-220 .006" K10
THERMAL PAD DO-4 LARGE K10
THERMAL PAD DO-5 LARGE K10
THERMAL PAD SIP .006" K10
THERMAL PAD TO-220 .006" K10
THERMAL PAD TO-220 .006" K10
THERMAL PAD TO-247 .006" K10
THERM PAD TO-220 CLIP .006" K10
THERMAL PAD TO-3 .005" Q3
THERMAL PAD TO-3 .005" Q3
THERMAL PAD TO-220 .005" Q3
THERMAL PAD TO-220 .005" Q3
THERMAL PAD DO-4 LARGE Q3
THERMAL PAD DO-5 LARGE Q3
THERMAL PAD SIP .005" Q3
THERMAL PAD TO-220 .005" Q3
THERMAL PAD TO-220 .005" Q3
THERMAL PAD TO-247 .005" Q3
THERM PAD TO-220 CLIP .005" Q3
THERMAL PAD CPU .63"X.63"
THERM PAD CPU 1.375" X 1.375"
THERMAL PAD TO-220 .015" SP2000
THERM PAD POWER MOD .005" Q3
THERM PAD POWER MOD .005" Q3
THERM PAD PWR MOD W/ADH Q3
THERM PAD TO-3 4LEAD .009" SP600
THERM PAD TO-3 4LEAD .006" K10
THERMAL PAD TO-3 4LEAD .005" Q3
THERMAL PAD RECT .005" Q3
THERMAL PAD RECT .006" K10
THERMAL PAD RECT .005" Q3
THERMAL PAD RECT .006" K10
THERMAL PAD TO-220 .005" K10
THERMAL PAD TO-220 .005" Q3