Packaging | Bulk | |
Type | DIP, 0.6" (15.24mm) Row Spacing | |
Number of Positions or Pins (Grid) | 28 (2 x 14) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 10µin (0.25µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Open Frame | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 10µin (0.25µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Polybutylene Terephthalate (PBT), Glass Filled | |
Operating Temperature | -55°C ~ 125°C | |
Termination Post Length | - | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | 1A | |
Contact Resistance | 20 mOhm | |
Other Names | XM2Z0072M XR2A2815 XR2A2815NC | |
call me | [email protected] |
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 14POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN