X66AK2H12AAWA2

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Specifications of X66AK2H12AAWA2

Packaging	Tray
Type	DSP+ARM®
Interface	EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0
Clock Rate	1.2GHz
Non-Volatile Memory	ROM (384 kB)
On-Chip RAM	12.75MB
Voltage - I/O	0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
Voltage - Core	Variable
Operating Temperature	-40°C ~ 100°C
Mounting Type	Surface Mount
Package / Case	1517-BBGA, FCBGA
Supplier Device Package	1517-FCBGA (40x40)
call me	[email protected]

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