TMS32C6713BGDPA200

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Specifications of TMS32C6713BGDPA200

Packaging	Tray
Type	Floating Point
Interface	Host Interface, I²C, McASP, McBSP
Clock Rate	200MHz
Non-Volatile Memory	External
On-Chip RAM	264kB
Voltage - I/O	3.30V
Voltage - Core	1.20V
Operating Temperature	-40°C ~ 105°C
Mounting Type	Surface Mount
Package / Case	272-BBGA
Supplier Device Package	272-BGA (27x27)
Other Names	296-26871 TMS32C6713BGDPA200-ND
call me	[email protected]

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Texas Instruments