Part Number

SIP1X08-001BLF

Manufacturer

Description
CONN SOCKET SIP 8POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors

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Specifications of SIP1X08-001BLF
PackagingBulk
TypeSIP
Number of Positions or Pins (Grid)8 (1 x 8)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200µin (5.08µm)
Contact Material - PostBrass
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Operating Temperature-
Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0
Current Rating-
Contact Resistance-
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