SIP1X08-001BLF

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Specifications of SIP1X08-001BLF

Packaging	Bulk
Type	SIP
Number of Positions or Pins (Grid)	8 (1 x 8)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200µin (5.08µm)
Contact Material - Post	Brass
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	-
Termination Post Length	0.125" (3.18mm)
Material Flammability Rating	UL94 V-0
Current Rating	-
Contact Resistance	-
call me	[email protected]

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