SBU130Z

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Specifications of SBU130Z

Packaging	Bulk
Type	SIP
Number of Positions or Pins (Grid)	13 (1 x 13)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	196.8µin (5.00µm)
Contact Material - Post	Brass
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55°C ~ 125°C
Termination Post Length	*
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	7 mOhm
Other Names	Q1420247
call me	[email protected]

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On-Shore Technology, Inc.