Part Number

ICA-308-SGG

Manufacturer

Description
CONN IC DIP SOCKET 8POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors

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Specifications of ICA-308-SGG
PackagingBulk
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)8 (2 x 4)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post30µin (0.76µm)
Contact Material - PostBrass
Housing MaterialPolyester, Glass Filled
Operating Temperature-55°C ~ 125°C
Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0
Current Rating1A
Contact Resistance10 mOhm
Other NamesQ3534367
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