ICA-308-SGG

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Specifications of ICA-308-SGG

Packaging	Bulk
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	8 (2 x 4)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30µin (0.76µm)
Contact Material - Post	Brass
Housing Material	Polyester, Glass Filled
Operating Temperature	-55°C ~ 125°C
Termination Post Length	0.125" (3.18mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	10 mOhm
Other Names	Q3534367
call me	[email protected]

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