HIC-764-SST

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Specifications of HIC-764-SST

Packaging	Tube
Type	DIP, 0.75" (19.05mm) Row Spacing
Number of Positions or Pins (Grid)	64 (2 x 32)
Pitch - Mating	0.070" (1.78mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.070" (1.78mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	200µin (5.08µm)
Contact Material - Post	Brass
Housing Material	Polyester, Glass Filled
Operating Temperature	-
Termination Post Length	0.118" (3.00mm)
Material Flammability Rating	UL94 V-0
Current Rating	-
Contact Resistance	-
call me	[email protected]

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