Part Number

HF115AC-0.0055-AC-105

Manufacturer

Description
THERM PAD SIP PKG W/ADH HI-FLOW
Category
Fans, Thermal Management
Family
Thermal - Pads, Sheets

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Specifications of HF115AC-0.0055-AC-105
UsageSIP
ShapeRectangle
Outline36.83mm x 21.29mm
Thickness0.0055" (0.140mm)
MaterialPhase Change Compound
AdhesiveAdhesive - One Side
Backing, CarrierFiberglass
ColorGray
Thermal Resistivity0.35°C/W
Thermal Conductivity0.8 W/m-K
Other NamesBER170
HF115AC-105
HF115AC00055AC105
HF115TAAC-105
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