Part Number

DS34S132GN+

Manufacturer

Description
IC TDM OVER PACKET 676-BGA
Category
Integrated Circuits (ICs)
Family
Interface - Telecom

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Specifications of DS34S132GN+
PackagingTray
FunctionTDM-over-Packet (TDMoP)
InterfaceTDMoP
Number of Circuits1
Voltage - Supply1.8V, 3.3V
Current - Supply-
Power (Watts)-
Operating Temperature-40°C ~ 85°C
Mounting TypeSurface Mount
Package / Case676-BGA
Supplier Device Package676-PBGA (27x27)
Includes-
Other Names90-34S13+2N0
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