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DIP632-001BLF

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Part Number

DIP632-001BLF

Manufacturer

Description
CONN IC DIP SOCKET 32POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
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Specifications of DIP632-001BLF
PackagingTube
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)32 (2 x 16)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200µin (5.08µm)
Contact Material - PostBrass
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature-
Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0
Current Rating-
Contact Resistance-
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