Part Number

BU400Z-178-HT

Manufacturer

Description
CONN IC DIP SOCKET 40POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors

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Specifications of BU400Z-178-HT
PackagingTube
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)40 (2 x 20)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating78.7µin (2.00µm)
Contact Material - MatingBeryllium Copper
Mounting TypeSurface Mount
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostCopper
Contact Finish Thickness - PostFlash
Contact Material - PostBrass
Housing MaterialPolybutylene Terephthalate (PBT), Glass Filled
Operating Temperature-55°C ~ 125°C
Termination Post Length0.060" (1.50mm)
Material Flammability RatingUL94 V-0
Current Rating1A
Contact Resistance7 mOhm
Other NamesBU400Z178HT
ED2211
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