BU160Z-178-HT

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Specifications of BU160Z-178-HT

Packaging	Tube
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	16 (2 x 8)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	78.7µin (2.00µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Surface Mount
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Copper
Contact Finish Thickness - Post	Flash
Contact Material - Post	Brass
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55°C ~ 125°C
Termination Post Length	0.060" (1.50mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	7 mOhm
Other Names	BU160Z178HT ED2204
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