BDN13-3CB/A01

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Specifications of BDN13-3CB/A01

Type	Top Mount
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Thermal Tape, Adhesive (Included)
Shape	Square, Pin Fins
Length	1.310" (33.27mm)
Width	1.310" (33.27mm)
Diameter	-
Height Off Base (Height of Fin)	0.355" (9.02mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	6.0°C/W @ 400 LFM
Thermal Resistance @ Natural	16.1°C/W
Material	Aluminum
Material Finish	Black Anodized
Other Names	294-1100 BDN133CB/A01
call me	[email protected]