APF30-30-13CB

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Specifications of APF30-30-13CB

Type	Top Mount
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Thermal Tape, Adhesive (Not Included)
Shape	Square, Fins
Length	1.181" (30.00mm)
Width	1.181" (30.00mm)
Diameter	-
Height Off Base (Height of Fin)	0.500" (12.70mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	2.5°C/W @ 200 LFM
Thermal Resistance @ Natural	-
Material	Aluminum
Material Finish	Black Anodized
Other Names	294-1155 APF303013CB
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