85-PGM11007-11H

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Specifications of 85-PGM11007-11H

Packaging	Bulk
Type	PGA
Number of Positions or Pins (Grid)	-
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10µin (0.25µm)
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-55°C ~ 125°C
Termination Post Length	0.165" (4.19mm)
Material Flammability Rating	UL94 V-0
Current Rating	3A
Contact Resistance	-
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