Part Number

85-PGM11007-11H

Manufacturer

Description
CONN SOCKET PGA GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors

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Specifications of 85-PGM11007-11H
PackagingBulk
TypePGA
Number of Positions or Pins (Grid)-
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
Features-
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 125°C
Termination Post Length0.165" (4.19mm)
Material Flammability RatingUL94 V-0
Current Rating3A
Contact Resistance-
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