834000T00000

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Specifications of 834000T00000

Type	Board Level
Package Cooled	TO-263 (D²Pak)
Attachment Method	SMD Pad
Shape	Rectangular
Length	0.763" (19.38mm)
Width	1.000" (25.40mm)
Diameter	-
Height Off Base (Height of Fin)	0.450" (11.43mm)
Power Dissipation @ Temperature Rise	1.5W @ 20°C
Thermal Resistance @ Forced Air Flow	4.0°C/W @ 200 LFM
Thermal Resistance @ Natural	-
Material	Copper
Material Finish	Tin
Other Names	834000T00000-ND CR518
call me	[email protected]

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