833900T00000

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Specifications of 833900T00000

Type	Board Level
Package Cooled	D²Pak, PowerSO-10
Attachment Method	SMD Pad
Shape	Rectangular, Fins
Length	0.590" (14.99mm)
Width	1.020" (25.91mm)
Diameter	-
Height Off Base (Height of Fin)	0.375" (9.52mm)
Power Dissipation @ Temperature Rise	2W @ 40°C
Thermal Resistance @ Forced Air Flow	5°C/W @ 400 LFM
Thermal Resistance @ Natural	-
Material	Copper
Material Finish	Tin
Other Names	833900T00000-ND CR504
call me	[email protected]

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