Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
MCU Flash | - | |
MCU RAM | 64KB | |
Peripherals | DMA, POR, WDT | |
Connectivity | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Speed | 800MHz | |
Primary Attributes | FPGA - 85K Logic Elements | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 896-BGA | |
Supplier Device Package | 896-FBGA (31x31) | |
Number of I/O | MCU - 181, FPGA - 288 | |
call me | [email protected] |
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