573400D00010G

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Specifications of 573400D00010G

Type	Top Mount
Package Cooled	D³Pak
Attachment Method	SMD Pad
Shape	Rectangular
Length	0.500" (12.70mm)
Width	1.220" (30.99mm)
Diameter	-
Height Off Base (Height of Fin)	0.401" (10.20mm)
Power Dissipation @ Temperature Rise	1W @ 20°C
Thermal Resistance @ Forced Air Flow	4°C/W @ 600 LFM
Thermal Resistance @ Natural	14°C/W
Material	Copper
Material Finish	Tin
Other Names	041506 HS339TR
call me	[email protected]