573100D00000G

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Specifications of 573100D00000G

Type	Top Mount
Package Cooled	TO-252 (DPak)
Attachment Method	SMD Pad
Shape	Rectangular
Length	0.315" (8.00mm)
Width	0.900" (22.86mm)
Diameter	-
Height Off Base (Height of Fin)	0.400" (10.16mm)
Power Dissipation @ Temperature Rise	0.75W @ 30°C
Thermal Resistance @ Forced Air Flow	12.5°C/W @ 600 LFM
Thermal Resistance @ Natural	15°C/W
Material	Copper
Material Finish	Tin
Other Names	041638 573100D00000G-ND HS407
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