44-547-11E

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Specifications of 44-547-11E

Packaging	Bulk
Type	SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid)	44 (2 x 22)
Pitch - Mating	-
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	20µin (0.51µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	20µin (0.51µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	-
Termination Post Length	0.150" (3.81mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	-
Other Names	44-547-11E-ND A857AR Q1834448
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