290-1294-00-3302J

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Specifications of 290-1294-00-3302J

Packaging	Bulk
Type	DIP, ZIF (ZIP)
Number of Positions or Pins (Grid)	90 (2 x 45)
Pitch - Mating	0.070" (1.78mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.070" (1.78mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30µin (0.76µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polysulfone (PSU), Glass Filled
Operating Temperature	-55°C ~ 125°C
Termination Post Length	0.130" (3.30mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	15 mOhm
Other Names	0 54007 53582 9 2901294003302J 3M5012 JE150140653
call me	[email protected]

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