Packaging | Tray | |
Type | CLCC | |
Number of Positions or Pins (Grid) | 68 (4 x 17) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 30µin (0.76µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Closed Frame | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 30µin (0.76µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | |
Operating Temperature | -55°C ~ 105°C | |
Termination Post Length | 0.100" (2.54mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | 1A | |
Contact Resistance | - | |
Other Names | 2006805400-011011002 2685401111102JH 3M6809B 5113869925 51138699253 5400767310 54007673101 80-6103-5173-8 80610351738 JE-1500-8572-6 JE150901401 | |
call me | [email protected] |
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 14POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN