Packaging | Tray | |
Type | CLCC | |
Number of Positions or Pins (Grid) | 68 (4 x 17) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 30µin (0.76µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Closed Frame | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 30µin (0.76µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | |
Operating Temperature | -55°C ~ 105°C | |
Termination Post Length | 0.100" (2.54mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | 1A | |
Contact Resistance | - | |
Other Names | 2006805400-000011002 2685401001102JH 3M6809A 5111526693 51115266935 5400733845 54007338451 80-6101-2420-0 80610124200 JE-1501-7717-6 JE150379194 | |
call me | [email protected] |
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 14POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN