25-0518-11

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Specifications of 25-0518-11

Packaging	Bulk
Type	SIP
Number of Positions or Pins (Grid)	25 (1 x 25)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10µin (0.25µm)
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-
Termination Post Length	0.125" (3.18mm)
Material Flammability Rating	UL94 V-0
Current Rating	3A
Contact Resistance	-
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