25-0503-30

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Specifications of 25-0503-30

Packaging	Bulk
Type	SIP
Number of Positions or Pins (Grid)	25 (1 x 25)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	-
Termination	Wire Wrap
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200µin (5.08µm)
Contact Material - Post	Brass
Housing Material	Polyamide (PA), Nylon, Glass Filled
Operating Temperature	-
Termination Post Length	0.500" (12.70mm)
Material Flammability Rating	UL94 HB
Current Rating	3A
Contact Resistance	-
Other Names	25050330 A209
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