| Packaging | Bulk | |
| Type | QFN | |
| Number of Positions or Pins (Grid) | 40 (4 x 10) | |
| Pitch - Mating | - | |
| Contact Finish - Mating | Gold | |
| Contact Finish Thickness - Mating | - | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | Closed Frame | |
| Termination | Solder | |
| Pitch - Post | - | |
| Contact Finish - Post | Gold | |
| Contact Finish Thickness - Post | - | |
| Contact Material - Post | Beryllium Copper | |
| Housing Material | Polyethersulfone (PES) | |
| Operating Temperature | - | |
| Termination Post Length | 0.118" (3.00mm) | |
| Material Flammability Rating | - | |
| Current Rating | - | |
| Contact Resistance | 25 mOhm | |
| Other Names | 240520501 3M10829 5111560225 51115602252 80001385923 | |
| call me | [email protected] | |

CONN IC DIP SOCKET 24POS GOLD

CONN IC DIP SOCKET 18POS GOLD

CONN IC DIP SOCKET 24POS GOLD

CONN IC DIP SOCKET 14POS TIN

CONN SOCKET SIP 12POS TIN

CONN SOCKET SIP 20POS TIN

CONN SOCKET SIP 25POS TIN

CONN SOCKET SIP 34POS TIN

CONN SOCKET SIP 12POS TIN

CONN SOCKET SIP 20POS TIN

CONN SOCKET SIP 25POS TIN

CONN SOCKET SIP 34POS TIN