Process | Lead Free | |
Type | Wire Solder | |
Flux Type | No-Clean | |
Composition | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | |
Wire Gauge | 20 AWG, 21 SWG | |
Diameter | 0.031" (0.79mm) | |
Core Size | 2.2% | |
Form | Spool, 454g (1 lb) | |
Melting Point | 422 ~ 428°F (217 ~ 220°C) | |
Shipping Info | - | |
Other Names | 24-7068-7601-ND 2470687601 KE1137 Q2171296 | |
call me | [email protected] |
SOLDER RMA FLUX 21AWG 63/37 1LB
SOLDER WATER SOLUABLE 25AWG 1LB
SOLDER RMA FLUX 25AWG 63/37 1LB
SOLDER WATER SOLUABLE 21AWG 1LB
SOLDER RA 19AWG 63/37 1LB
SOLDER RA 16AWG 63/37 1LB
SOLDER NO-CLEAN 21AWG 1LB
SOLDER NO-CLEAN 25AWG 1LB
SOLDER RA 25AWG 63/37 1LB
SOLDER RA 21AWG 63/37 1LB
SOLDER NO-CLEAN .031" X 20'
SOLDER NO-CLEAN ANTISTAT .031"