232-1297-00-3303

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Specifications of 232-1297-00-3303

Packaging	Bulk
Type	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)	32 (2 x 16)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	250µin (6.35µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	250µin (6.35µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyether Imide (PEI), Glass Filled
Operating Temperature	-55°C ~ 105°C
Termination Post Length	0.110" (2.78mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	25 mOhm
Other Names	2321297003303 5113523884 51135238844 JE150126223 Q975838
call me	[email protected]

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