232-1270-02-0602

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Specifications of 232-1270-02-0602

Packaging	Bulk
Type	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	32 (2 x 16)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30µin (0.76µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polysulfone (PSU), Glass Filled
Operating Temperature	-55°C ~ 125°C
Termination Post Length	0.154" (3.90mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	25 mOhm
Other Names	00051115304521 JE150378329
call me	[email protected]

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