2292BG

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Specifications of 2292BG

Type	Board Level
Package Cooled	BGA
Attachment Method	Thermal Tape, Adhesive (Not Included)
Shape	Cylindrical
Length	-
Width	-
Diameter	0.300" (7.62mm) ID, 1.125" (28.57mm) OD
Height Off Base (Height of Fin)	-
Power Dissipation @ Temperature Rise	1.5W @ 40°C
Thermal Resistance @ Forced Air Flow	8.0°C/W @ 400 LFM
Thermal Resistance @ Natural	-
Material	Aluminum
Material Finish	Black Anodized
Other Names	034182
call me	[email protected]

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