228-7396-55-1902

To learn about the specification of 228-7396-55-1902, please search the datasheet by clicking the link above. If you couldn't find the correct datasheet, please refer to the manufacturer's official datasheet.
To process your RFQ, please add 228-7396-55-1902 with quantity into BOM.
Omoelec.com does NOT require any registration to request a quote of 228-7396-55-1902.
We are offering 228-7396-55-1902 for competitive price in the global market, please send us a quote request for pricing. Thank you!

Quick Order

Specifications of 228-7396-55-1902

Packaging	Bulk
Type	SOIC
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch - Mating	-
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	-
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30µin (0.76µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyethersulfone (PES), Glass Filled
Operating Temperature	-55°C ~ 150°C
Termination Post Length	0.140" (3.56mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	-
Other Names	0 51138 76532 3 2.2874E+12 2287396551902 3M5059 5113876532 51138765323 JE150900890
call me	[email protected]

228-7396-55-1902 Related Products

3M