228-5204-01

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Specifications of 228-5204-01

Packaging	Bulk
Type	QFN
Number of Positions or Pins (Grid)	28 (4 x 7)
Pitch - Mating	0.020" (0.50mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	-
Contact Finish - Post	Gold
Contact Finish Thickness - Post	-
Contact Material - Post	Beryllium Copper
Housing Material	Polyethersulfone (PES)
Operating Temperature	-
Termination Post Length	0.118" (3.00mm)
Material Flammability Rating	-
Current Rating	-
Contact Resistance	25 mOhm
Other Names	228520401 3M10838 5111560219 51115602191 80001385865
call me	[email protected]

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