Packaging | Bulk | |
Type | DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing | |
Number of Positions or Pins (Grid) | 28 (2 x 14) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 30µin (0.76µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Connector | |
Features | Closed Frame | |
Termination | Press-Fit | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 30µin (0.76µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Polysulfone (PSU), Glass Filled | |
Operating Temperature | -55°C ~ 125°C | |
Termination Post Length | 0.110" (2.78mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | 1A | |
Contact Resistance | 15 mOhm | |
Other Names | 0 51138 69554 5 2284817000602J 3M5001 5113869554 51138695545 JE150900254 | |
call me | [email protected] |
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 14POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN