224-5809-00-0602

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Specifications of 224-5809-00-0602

Packaging	Bulk
Type	SIP, ZIF (ZIP)
Number of Positions or Pins (Grid)	24 (1 x 24)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30µin (0.76µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polysulfone (PSU), Glass Filled
Operating Temperature	-55°C ~ 125°C
Termination Post Length	0.130" (3.30mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	-
Other Names	0 51138 76520 0 2.24581E+12 2245809000602 3M5063 5111530440 51115304408 JE150378287 JE150900064
call me	[email protected]

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