216-6278-00-3303

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Specifications of 216-6278-00-3303

Packaging	Bulk
Type	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	16 (2 x 8)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	250µin (6.35µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	250µin (6.35µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyether Imide (PEI), Glass Filled
Operating Temperature	-55°C ~ 105°C
Termination Post Length	0.110" (2.78mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	-
Other Names	2-001604840000033003 2.16628E+12 2001604840-000033003 216-4840-00-3303 2166278003303 3M1603 51138-76511-8 5113876511 51138765118 5400733859 54007338598 80-6101-2435-8 80610124358 JE-1500-9273-0 JE150092730
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