Packaging | Bulk | |
Type | PGA, ZIF (ZIP) | |
Number of Positions or Pins (Grid) | 625 (25 x 25) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 30µin (0.76µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | - | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 30µin (0.76µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Polyethersulfone (PES) | |
Operating Temperature | -55°C ~ 150°C | |
Termination Post Length | 0.130" (3.30mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | 1A | |
Contact Resistance | - | |
Other Names | 0 51138 69644 3 20063259UN1900 3M5073 5113869644 51138696443 JE150901377 | |
call me | [email protected] |
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 14POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN