| Packaging | Bulk | |
| Type | PGA, ZIF (ZIP) | |
| Number of Positions or Pins (Grid) | 100 (10 x 10) | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Gold | |
| Contact Finish Thickness - Mating | 30µin (0.76µm) | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | - | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Gold | |
| Contact Finish Thickness - Post | 30µin (0.76µm) | |
| Contact Material - Post | Beryllium Copper | |
| Housing Material | Polyethersulfone (PES) | |
| Operating Temperature | -55°C ~ 150°C | |
| Termination Post Length | 0.130" (3.30mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | 1A | |
| Contact Resistance | - | |
| Other Names | 0 51138 69658 0 20063109UN1900 3M5066 5113869658 51138696580 JE150901237 | |
| call me | [email protected] | |

CONN IC DIP SOCKET 24POS GOLD

CONN IC DIP SOCKET 18POS GOLD

CONN IC DIP SOCKET 24POS GOLD

CONN IC DIP SOCKET 14POS TIN

CONN SOCKET SIP 12POS TIN

CONN SOCKET SIP 20POS TIN

CONN SOCKET SIP 25POS TIN

CONN SOCKET SIP 34POS TIN

CONN SOCKET SIP 12POS TIN

CONN SOCKET SIP 20POS TIN

CONN SOCKET SIP 25POS TIN

CONN SOCKET SIP 34POS TIN