2-1571994-0

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Specifications of 2-1571994-0

Packaging	Bulk
Type	SIP
Number of Positions or Pins (Grid)	20 (1 x 20)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	20µin (0.51µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	20µin (0.51µm)
Contact Material - Post	Copper
Housing Material	Thermoplastic, Polyester
Operating Temperature	-
Termination Post Length	0.125" (3.18mm)
Material Flammability Rating	UL94 V-0
Current Rating	-
Contact Resistance	-
Other Names	2-1571994-0-ND A115087
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