1981837-2

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Specifications of 1981837-2

Packaging	Tray
Type	LGA
Number of Positions or Pins (Grid)	1366 (32 x 41)
Pitch - Mating	0.040" (1.01mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30µin (0.76µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Surface Mount
Features	Open Frame
Termination	Solder
Pitch - Post	0.040" (1.01mm)
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	Copper Alloy
Housing Material	Thermoplastic
Operating Temperature	-
Termination Post Length	-
Material Flammability Rating	UL94 V-0
Current Rating	-
Contact Resistance	-
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