Part Number

1810-DG-225-RC

Manufacturer

Description
MITYDSP-1810F SOM OMAP-L138
Category
Integrated Circuits (ICs)
Family
Embedded - Microcontroller or Microprocessor Modules

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Specifications of 1810-DG-225-RC
Module/Board TypeMPU, FPGA Core
Core ProcessorARM926EJ-S, AM1810
Co-ProcessorSpartan-6, XC6SLX16
Speed375MHz
Flash Size256MB (NAND), 8MB (NOR)
RAM Size8KB (Internal), 128MB (External)
Connector TypeSO-DIMM-200
Size / Dimension2.66" x 2" (67.6mm x 50.8mm)
Operating Temperature0°C ~ 70°C
Other Names1810DG225RC
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