100-018-001

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Specifications of 100-018-001

Packaging	Bulk
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	18 (2 x 9)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	8µin (0.20µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame, Seal Tape
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	Flash
Contact Material - Post	Brass
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	-65°C ~ 125°C
Termination Post Length	0.126" (3.20mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	-
Other Names	05111165336 JE150135927
call me	[email protected]

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