Part Number

08-2513-11

Manufacturer

Description
CONN IC DIP SOCKET 8POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors

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Specifications of 08-2513-11
PackagingBulk
TypeDIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)8 (2 x 4)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-
Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0
Current Rating3A
Contact Resistance-
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