Packaging | Tray | |
Type | LGA | |
Number of Positions or Pins (Grid) | 1156 (40 x 40) | |
Pitch - Mating | 0.036" (0.91mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 15µin (0.38µm) | |
Contact Material - Mating | Copper Alloy | |
Mounting Type | Surface Mount | |
Features | Closed Frame | |
Termination | Solder | |
Pitch - Post | 0.036" (0.91mm) | |
Contact Finish - Post | - | |
Contact Finish Thickness - Post | - | |
Contact Material - Post | - | |
Housing Material | Thermoplastic | |
Operating Temperature | - | |
Termination Post Length | - | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | 0.5A | |
Contact Resistance | 19 mOhm | |
Other Names | 0475-96-0532 475-96-0532 47596-0532 475960532 | |
call me | [email protected] |
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 14POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN